Pay in 4 interest-free payments of $1187.50 Learn more
Ships within 48 hours · Estimated delivery Jul 27 - Aug 1
edge trim and other processes are not yet standardized
SEMI D24 — Specification for Glass Substrates Used to Manufacture Flat Panel Displays
fault classification (FC)
the openings of the glass substrate may be intended to be further processed with metal fillings
This Standard applies to components that are installed in between a substrate and a component in a sandwich or stacked manner
Global Semiconductor Packaging Materials Outlook - 2024 Edition Lang-Chinese (Traditional) edge trim and other processesJoint report from SEMI and TechSearch International examining the global semiconductor packaging materials market size and 5 year forecast to 2028. Packaging material segments include substrates, leadframes, bonding wires, underfill materials, die attach materials, solder balls, wafer level packages, and plating chemicals. Market size is broken out by region and is represented in units and revenue.
US$ 19.99
US$ 140.28
US$ 125.47
US$ 141.38