G10100 - SEMI G101 - Specification for Modulus of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G101-1122 - Current High Throughput Material Development for

High Throughput Material Development for Extreme Environment Printed Electronics

NOTICE: This Document was completely rewritten in 2019

In microelectronics

The ratio of the length to the maximum dimension of the cross section of the specimen shall not be less than 3:1 (refer to ¶ 12

The type of GNP

G10100 - SEMI G101 - Specification for Modulus of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G101-1122 - Current High Throughput Material Development forMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of